Motherson Sumi Systems Limited (MSSL) and Balda AG (Balda) have agreed to set up a joint venture for development of precision moulds , design and manufacture of parts for mobile phones including accessories and appliances for mobile phones at Chennai. With an investment of US 10 millions in the next 12 to 18 months, the plant is scheduled to be ready for production by the end of second quarter of 2006. The joint venture company expects to have sales of US 18 millions in the year 2006-07. The Joint venture will have shareholding in the ratio of 40: 60 for MSSL and Balda respectively. The joint venture would supply parts to Balda's global customers who have announced to set up facilities for manufacture of mobile hand sets or have already started to do so.
Balda is the world's second largest systems supplier of precision components made from high-performance plastics for the mobile-phone industry. Besides customers in this core market Balda also supplies customers in near-by industries. Its portfolio of goods and services includes not just production, but also the design of new products, the development and manufacture of moulds and production systems, product finishing with all common types of surfaces as well as assembly. The company is based in Bad Oeynhausen in East Westphalia. In addition to the sites in Germany the technology company has production plants in China, Malaysia, Brazil and with this joint venture ,will have now facilities in India.